Multilayer ceramic capacitor

ABSTRACT

A multilayer ceramic capacitor includes first dielectric ceramic layers each with a thickness of about 0.48 μm or more and about 0.50 μm or less in the lamination direction, and additional dielectric ceramic layers each with a thickness of about 10 μm or more and about 15 μm or less in the width direction. A number of dielectric particles in each first dielectric ceramic layer in a thickness direction is three or more and six or less. A number of dielectric particles in each additional dielectric ceramic layer in a thickness direction is 100 or more and 150 or less. When the number of dielectric particles in each of first dielectric ceramic layer is NT, and the number of dielectric particles in each additional dielectric ceramic layer is NW, a ratio of NT to NW is about 1:23.08 or more and about 1:46.15 or less.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority to Japanese PatentApplication No. 2021-023429 filed on Feb. 17, 2021. The entire contentsof this application are hereby incorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a multilayer ceramic capacitor.

2. Description of the Related Art

Conventionally, a multilayer ceramic capacitor has been known whichincludes a multilayer body in which dielectric ceramic layers and theinternal electrode layers are stacked, and external electrodes providedon both end portions of this multilayer body. In relation to such amultilayer ceramic capacitor, a multilayer ceramic capacitor has beenknown which includes a side margin portion that protects the sidesurface of the multilayer body and prevents the internal electrodelayers at the side surface from being connected to the externalelectrode layer (for example, refer to Japanese Unexamined PatentApplication, Publication No. 2019-197790).

It is necessary to reduce the thickness of the dielectric ceramic layersand increase the number of laminated layers in order to achieve amultilayer ceramic capacitor with high capacitance, and at the sametime, reductions in size and in thickness of the multilayer ceramiccapacitor has also been demanded. However, when the side margin portionis reduced in thickness for the purpose of reducing size, moistureresistance is reduced, and thus the reliability is degraded. Therefore,it is difficult to achieve both high capacitance and reliability.

SUMMARY OF THE INVENTION

Preferred embodiments of the present invention provide multilayerceramic capacitors that each achieve high capacitance and reliability,while achieving size reduction.

A preferred embodiment of the present invention provides a multilayerceramic capacitor including a multilayer body including dielectricceramic layers and internal electrode layers which are laminated in alamination direction, and external electrodes each connected to theinternal electrode layers, wherein the multilayer body further includesa first main surface and a second main surface opposing each other inthe lamination direction, a first side surface and a second side surfaceopposing in a width direction which is perpendicular or substantiallyperpendicular to the lamination direction, a first end surface and asecond end surface opposing each other in a length directionperpendicular or substantially perpendicular to the lamination directionand the width direction, an inner layer portion including the internalelectrode layers laminated alternately with the dielectric ceramiclayers interposed therebetween, and outer layer portions that sandwichthe inner layer portion in the lamination direction, the dielectricceramic layers includes first dielectric ceramic layers laminated withthe internal electrode layers interposed therebetween in the inner layerportion, and second dielectric ceramic layers defining and functioningas the outer layer portions, the multilayer ceramic capacitor furtherincludes additional dielectric ceramic layers respectively on the firstside surface and the second side surface and sandwiching the inner layerportion and the outer layer portions in the width direction, the firstdielectric ceramic layers each have a thickness of about 0.48 μm or moreand about 0.50 μm or less in the lamination direction, the additionaldielectric ceramic layers each have a thickness of about 10 μm or moreand about 15 μm or less in the width direction, a number of dielectricparticles in each of the first dielectric ceramic layers in a thicknessdirection corresponding to the lamination direction is three or more andsix or less, a number of dielectric particles in each of the additionaldielectric ceramic layers in a thickness direction corresponding to thewidth direction is 100 or more and 150 or less, and when a number ofdielectric particles in each of the first dielectric ceramic layers in athickness direction corresponding to the lamination direction is definedas N_(T), and a number of dielectric particles present in each of theadditional dielectric ceramic layers in a thickness directioncorresponding to the width direction is defined as N_(W), a ratio ofN_(T) to N_(W) is about 1:23.08 or more and about 1:46.15 or less.

According to preferred embodiments of the present application, it ispossible to provide multilayer ceramic capacitors which each achieveboth high capacitance and reliability, while achieving the reduction insize.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view of a multilayer ceramic capacitoraccording to a preferred embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 1 .

FIG. 3 is a cross-sectional view take along the line III-III in FIG. 1 .

FIG. 4 is an enlarged view of a portion IV in FIG. 3 .

FIG. 5 is a cross-sectional view showing the amount of deviation at aside surface of internal electrode layers of a multilayer body includingdielectric ceramic layers according to a preferred embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of the present invention will be described indetail below with reference to the drawings.

FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor10 according to a preferred embodiment of the present invention. FIG. 2is a cross-sectional view taken along the line II-II shown in FIG. 1 .FIG. 3 is a cross-sectional view taken along the line III-III shown inFIG. 1 .

As shown in FIG. 1 , the multilayer ceramic capacitor 10 of the presentpreferred embodiment is an electronic component having a rectangularparallelepiped or substantially rectangular parallelepiped shape. Themultilayer ceramic capacitor 10 includes a base body 11, and a pair ofexternal electrodes 16.

In FIGS. 1 to 3 , the arrow T indicates the lamination (stacking)direction of the multilayer ceramic capacitor 10 and the base body 11.In FIGS. 1 and 2 , the arrow L indicates a length directionperpendicular or substantially perpendicular to the lamination direction(T) of the multilayer ceramic capacitor 10 and the base body 11. InFIGS. 1 and 3 , the arrow W indicates a width direction perpendicular orsubstantially perpendicular to the lamination direction (T) and thelength direction (L) of the multilayer ceramic capacitor 10 and the basebody 11. It should be noted that the lamination direction (T) and thewidth direction (W) are also shown in FIGS. 4 and 5 .

As shown in FIGS. 1 and 2 , a pair of external electrodes 16 are spacedapart from each other, and cover the outer surfaces of both ends in thelength direction (L) of the base body 11. The pair of externalelectrodes 16 each include a conductive film.

The pair of external electrodes 16 each include a laminated filmincluding, for example, a sintered metal layer and a plated layer. Thesintered metal layer is formed by firing a paste such as, for example,Cu, Ni, Ag, Pd, Ag—Pd alloy, and Au. The plated layer includes, forexample, a Ni-plated layer and a Sn-plated layer covering the Ni-platedlayer. The plated layer may be, for example, a Cu-plated layer or anAu-plated layer instead of these layers. Furthermore, the pair ofexternal electrodes 16 may include only the plated layer. Furthermore, aconductive resin paste can be used as the pair of external electrodes16.

As shown in FIGS. 2 and 3 , the base body 11 includes a multilayer body12 including a plurality of dielectric ceramic layers 13 and a pluralityof internal electrode layers 14 stacked alternately along the laminationdirection (T), and a pair of additional dielectric ceramic layers 15covering both side surfaces of the multilayer body 12 in the widthdirection (W). The additional dielectric ceramic layers 15 may bereferred to as side gap portions. The multilayer body 12 has thelamination direction (T), the length direction (L), and the widthdirection (W), which are the same as those of the multilayer ceramiccapacitor 10 and the base body 11.

The dielectric ceramic layers 13 and the additional dielectric ceramiclayers 15 are formed by firing a ceramic material including bariumtitanate as a main component, for example. The dielectric ceramic layers13 and the additional dielectric ceramic layers 15 may be made of otherhigh dielectric constant ceramic materials such as, for example, thosemainly including CaTiO₃, SrTiO₃, CaZrO₃ or the like. The ceramicmaterial included in the dielectric ceramic layers 13 and the additionaldielectric ceramic layers 15 includes additives such as, for example,Si, Mg, Mn, Sn, Cu, rare earth, Ni and Al, for the purpose of adjustingthe composition.

The internal electrode layers 14 are each made of a metal material suchas, for example, Ni, Cu, Ag, Pd, Ag—Pd alloy, and Au. The internalelectrode layers 14 may be made of other conductive materials which arenot limited to these metal materials.

As shown in FIG. 2 , one of the pair of internal electrode layers 14,which are adjacent to each other in the lamination direction (T) andhave the dielectric ceramic layer 13 interposed therebetween, iselectrically connected to one of the pair of external electrodes 16 inthe multilayer ceramic capacitor 10. The other one of the pair ofinternal electrode layers 14, which are adjacent to each other in thelamination direction (T) and have the dielectric ceramic layer 13interposed therebetween, is electrically connected to the other one ofthe pair of external electrodes 16 in the multilayer ceramic capacitor10. In this way, a plurality of capacitor elements are electricallyconnected in parallel the pair of external electrodes 16.

As shown in FIGS. 2 and 3 , the dielectric ceramic layer 13 includes aplurality of first dielectric ceramic layers 13 a sandwiched between theinternal electrode layers 14, and a pair of second dielectric ceramiclayers 13 b that are provided on both sides in the lamination direction(T) and larger in thickness than the first dielectric ceramic layers 13a.

As shown in FIGS. 2 and 3 , the multilayer body 12 includes an innerlayer portion 12A in which each of the plurality of internal electrodelayers 14 is opposed with the first dielectric ceramic layer 13 ainterposed therebetween, and a pair of outer layer portion 12B thatsandwich the inner layer portion 12A in the lamination direction (T). Inother words, in the inner layer portion 12A, the plurality of internalelectrode layers 14 are alternately laminated with the first dielectricceramic layers 13 a interposed therebetween.

Furthermore, the multilayer body 12 includes a first main surface 17 a 1and a second main surface 17 a 2 opposed to each other in the laminationdirection (T), a first side surface 17 b 1 and a second side surface 17b 2 opposed to each other in the width direction (W), and a first endsurface 17 c 1 and a second end surface 17 c 2 opposed to each other inthe length direction (L).

At each of the first end surface 17 c 1 and the second end surface 17 c2 of the multilayer body 12, ends on one side in the length direction(L) of the internal electrode layers 14 to be connected to the externalelectrode 16 are exposed. On the other hand, at each of the first sidesurface 17 b 1 and the second side surface 17 b 2 of the multilayer body12, ends on both sides in the width direction (W) of the internalelectrode layers 14 are exposed.

As shown in FIG. 3 , at the first side surface 17 b 1 and the secondside surface 17 b 2 of the multilayer body 12, the additional dielectricceramic layers 15 cover each of the first side surface 17 b 1 and thesecond side surface 17 b 2.

The multilayer ceramic capacitor 10 of the present preferred embodimentis manufactured, for example, such that a ceramic material such as, forexample, a ceramic green sheet, etc. that defines and functions as thedielectric ceramic layers 13 and a conductive material such as, forexample, a conductive paste, etc. that defines and functions as theinternal electrode layers 14 are laminated to form the multilayer body12, and a ceramic material such as, for example, a ceramic green sheet,etc. that defines and functions as the additional dielectric ceramiclayers 15 is laminated on the first side surface 17 b 1 and the secondside surface 17 b 2 of the multilayer body 12. Furthermore, eachmaterial defining and functioning as the multilayer body 12 and theadditional dielectric ceramic layers 15 is fired, following which theexternal electrodes 16 are formed by, for example, firing, plating orthe like, to manufacture the multilayer ceramic capacitor 10.

FIG. 4 is an enlarged view of a portion indicated by IV in FIG. 3 , andshows an end portion in the width direction (W) of the internalelectrode layers 14, the first dielectric ceramic layer 13 a providedbetween the internal electrode layers 14, and the additional dielectricceramic layers 15 in contact with the internal electrode layers 14 andthe second side surface 17 b 2 of the dielectric ceramic layer 13 a.

The first dielectric ceramic layer 13 a includes dielectric particles 21derived from the material of the first dielectric ceramic layer 13 a. Inaddition, the additional dielectric ceramic layer 15 includes dielectricparticles 31 derived from the material of the additional dielectricceramic layers 15.

In the present preferred embodiment, the thickness T1 of the firstdielectric ceramic layer 13 a in the lamination direction (T) is, forexample, about 0.48 μm or more and about 0.50 μm or less. On the otherhand, the thickness T2 of the additional dielectric ceramic layer 15 inthe width direction (W) is, for example, about 10 μm or more and about15 μm or less.

In the present preferred embodiment, it is preferable that the number ofdielectric particles 21 in the first dielectric ceramic layer 13 a inthe thickness direction corresponding to the lamination direction (T) isthree or more and six or less, for example. On the other hand, it ispreferable that the number of dielectric particles 31 present in theadditional dielectric ceramic layer 15 in the thickness directioncorresponding to the width direction (W) is 100 or more and 150 or less,for example.

Furthermore, the number of dielectric particles 21 in the firstdielectric ceramic layer 13 a in the thickness direction correspondingto the lamination direction (T) is defined as N_(T). Furthermore, thenumber of dielectric particles 31 in the additional dielectric ceramiclayer 15 in the thickness direction corresponding to the width direction(W) is defined as N_(W). It is preferable that the ratio of N_(T) toN_(W) is about 1:23.08 or more and about 1:46.15 or less, for example.In other words, for example, it is preferable that the number N_(W) isabout 23.08 or more and about 46.15 or less when the number N_(T) is 1.

For example, as a specific example, the thickness T2 of the additionaldielectric ceramic layer 15 is about 18,000 nm, and the average particlesize of the dielectric particles 31 in the additional dielectric ceramiclayer 15 and located on the straight line from the center or approximatecenter to the side surface in the middle in the thickness direction isabout 130 nm. In this case of the specific example, the number N_(W) ofdielectric particles 31 in the thickness direction of the additionaldielectric ceramic layer 15 is about 138.462 by calculation. On theother hand, when the number N_(T) of the dielectric particles 21 in thefirst dielectric ceramic layer 13 a in the thickness direction locatedon the straight line in the lamination direction at the center portionin the width direction, thickness direction, and the length direction isthree or more and six or less. Therefore, the ratio in the number ofparticles of N_(T) to N_(W) is about 1:23.08 or more and about 46.15 orless.

Therefore, in the present preferred embodiment, the average particlesize of the dielectric particles 21 included in the first dielectricceramic layer 13 a is significantly larger than the average particlesize of the dielectric particles 31 contained in the additionaldielectric ceramic layer 15. In the present specification, the averageparticle size indicates a circular equivalent particle size (volume D50diameter) having an integrated number distribution of about 50% whenimage analysis is performed by a scanning electron microscope (SEM) in apredetermined region.

In the present preferred embodiment, as shown in FIG. 5 , the maximumdeviation amount in the width direction (W) of edges 14 a of all of theinternal electrode layers 14 on the second side surface 17 b 2 of themultilayer body 12 is, for example, preferably about 0.5 μm or less. Thesame applies to the first side surface 17 b 1 of the multilayer body 12,and the maximum deviation amount in the width direction (W) of the edgesof the internal electrode layers 14 may be about 0.5 μm or less, forexample.

The maximum deviation amount referred to herein is a difference D in thewidth direction (W) between the inner most edge 14 a (14E in FIG. 5 ) inthe width direction (W) of the internal electrode layer 14, and theouter most edge 14 a (14F in FIG. 5 ) in the width direction (W) of theinternal electrode layer 14.

In the present preferred embodiment, when both of the first dielectricceramic layer 13 a and the additional dielectric ceramic layer 15include Mg, for example, it is preferable that the content of Mgincluded in the additional dielectric ceramic layer 15 is greater thanthe content of Mg included in the first dielectric ceramic layer 13 a.Furthermore, even when the first dielectric ceramic layer 13 a does notinclude Mg, it is preferable that the additional dielectric ceramiclayer 15 includes Mg.

Mg has an advantageous effect of reducing or preventing the grain growthof the dielectric ceramic layer during firing. Therefore, by adjustingthe content of Mg included in the dielectric ceramic layer, the size ofthe particles included in the dielectric ceramic layer can be adjusted.When the content of Mg included in the additional dielectric ceramiclayer 15 is greater than the content of Mg included in the firstdielectric ceramic layer 13 a, it is possible to easily adjust the ratioof the number of the dielectric particles 21 in the first dielectricceramic layer 13 a in the thickness direction corresponding to thelamination direction (T), to the number of dielectric particles 31 inthe additional dielectric ceramic layer 15 in the thickness directioncorresponding to the width direction (W).

In addition, in the present preferred embodiment, it is possible tomanufacture a small-size multilayer ceramic capacitor 10 with an overalldimension having the length of about 0.40 mm or more and about 0.60 mmor less in the length direction (L), the length of about 0.20 mm or moreand about 0.30 mm or less in the width direction (W), and the length ofabout 0.20 mm or more and about 0.50 mm or less in the laminationdirection (T), for example.

The multilayer ceramic capacitor 10 according to the present preferredembodiment described above exhibits the following advantageous effects.

(1) The multilayer ceramic capacitor 10 according to the presentpreferred embodiment includes the multilayer body 12 including thedielectric ceramic layers 13 and the internal electrode layers 14 whichare laminated in the lamination direction (T), and the externalelectrodes 16 each connected to the internal electrode layers 14, themultilayer body 12 further including the first main surface 17 a 1 andthe second main surface 17 a 2 opposing each other in the laminationdirection (T), the first side surface 17 b 1 and the second side surface17 b 2 opposing in the width direction (W) which is perpendicular orsubstantially perpendicular to the lamination direction (T), the firstend surface 17 c 1 and the second end surface 17 c 2 opposing each otherin the length direction (L) perpendicular or substantially perpendicularto the lamination direction (T) and the width direction (W), the innerlayer portion 12A including the internal electrode layers 14 laminatedalternately with the dielectric ceramic layers 13 interposedtherebetween, and the outer layer portions 12B that sandwich the innerlayer portion 12A in the lamination direction (T), the dielectricceramic layers 13 including the first dielectric ceramic layers 13 alaminated with the internal electrode layers 14 interposed therebetweenin the inner layer portion 12A, and the second dielectric ceramic layers13 b defining and functioning as the outer layer portions 12B, themultilayer ceramic capacitor 10 further including the additionaldielectric ceramic layers 15 respectively on the first side surface 17 b1 and the second side surface 17 b 2 and sandwiching the inner layerportion 12A and the outer layer portions 12B in the width direction (W),the first dielectric ceramic layers 13 a each having the thickness T1 ofabout 0.48 μm or more and about 0.50 μm or less in the laminationdirection (T), the additional dielectric ceramic layers 15 each havingthe thickness T2 of about 10 μm or more and about 15 μm or less in thewidth direction (W), the number of dielectric particles 21 in each ofthe first dielectric ceramic layers 13 a in a thickness directioncorresponding to the lamination direction (T) is three or more and sixor less, the number of dielectric particles 31 in each of the additionaldielectric ceramic layers 15 in a thickness direction corresponding tothe width direction (W) is 100 or more and 150 or less, and, when thenumber of dielectric particles 21 in each of the first dielectricceramic layers 13 a in a thickness direction corresponding to thelamination direction (T) is defined as N_(T), and the number ofdielectric particles 31 present in each of the additional dielectricceramic layers 15 in a thickness direction corresponding to the widthdirection (W) is defined as N_(W), the ratio of N_(T) to N_(W) is about1:23.08 or more and about 1:46.15 or less.

With such a configuration, it is possible to achieve higher capacitanceby making the particle size of the dielectric particles 21 included inthe first dielectric ceramic layer 13 a larger. On the other hand, sincethe dielectric particles 31 included in the additional dielectricceramic layer 15 are small in particle size, the entire surface areabecomes larger, and the interface defining and functioning as thesurface area also becomes larger, such that moisture resistance isimproved. As a result, it is possible to achieve both high capacitanceand reliability, while achieving a reduction in size.

(2) In the multilayer ceramic capacitor 10 according to the presentpreferred embodiment, the average particle size of the dielectricparticles 21 included in each of the first dielectric ceramic layers 13a is larger than the average particle size of the dielectric particles31 included in each of the additional dielectric ceramic layers 15. Withsuch a configuration, it is possible to achieve higher capacitance.

(3) In the multilayer ceramic capacitor 10 according to the presentpreferred embodiment, the maximum deviation amount in the widthdirection (W) of the edges 14 a of the internal electrode layers 14serving as the first side surface 17 b 1 and the second side surface 17b 2 of the multilayer body 12 is about 0.5 μm or less.

With such a configuration, the first side surface 17 b 1 and the secondside surface 17 b 2 of the multilayer body 12 become flat, and when theadditional dielectric ceramic layer 15 is attached to the first sidesurface 17 b 1 and the second side surface 17 b 2, it is possible toattach the additional dielectric ceramic layer 15 to the flat surfacewithout irregularity.

(4) In the multilayer ceramic capacitor 10 according to the presentpreferred embodiment, the additional dielectric ceramic layers 15 eachinclude Mg, and the content of Mg included in the additional dielectricceramic layer 15 is greater than the content of Mg included in each ofthe first dielectric ceramic layers 13 a.

With such a configuration, it is possible to easily adjust the ratio ofthe number of the dielectric particles 21 in the first dielectricceramic layer 13 a in the lamination direction (T), to the number ofdielectric particles 31 in the additional dielectric ceramic layer 15 inthe width direction (W).

(5) The multilayer ceramic capacitor 10 according to the presentpreferred embodiment has overall dimensions of a length of about 0.40 mmor more and about 0.60 mm or less in the length direction (L), a lengthof about 0.20 mm or more and about 0.30 mm or less in the widthdirection (W), and a length of about 0.20 mm or more and about 0.50 mmor less in the lamination direction (T).

With such a configuration, it is possible to achieve both highcapacitance and reliability, while achieving a reduction in size.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. A multilayer ceramic capacitor comprising: amultilayer body including dielectric ceramic layers and internalelectrode layers laminated in a lamination direction; and externalelectrodes each connected to the internal electrode layers; wherein themultilayer body further includes: a first main surface and a second mainsurface opposing each other in the lamination direction; a first sidesurface and a second side surface opposing in a width direction which isperpendicular or substantially perpendicular to the laminationdirection; a first end surface and a second end surface opposing eachother in a length direction perpendicular or substantially perpendicularto the lamination direction and the width direction; an inner layerportion including the internal electrode layers laminated alternatelywith the dielectric ceramic layers interposed therebetween; and outerlayer portions sandwiching the inner layer portion in the laminationdirection; the dielectric ceramic layers include first dielectricceramic layers laminated with the internal electrode layers interposedtherebetween in the inner layer portion, and second dielectric ceramiclayers defining and functioning as the outer layer portions; themultilayer ceramic capacitor further includes additional dielectricceramic layers respectively on the first side surface and the secondside surface and sandwiching the inner layer portion and the outer layerportions in the width direction; the first dielectric ceramic layerseach have a thickness of about 0.48 μm or more and about 0.50 μm or lessin the lamination direction; the additional dielectric ceramic layerseach have a thickness of about 10 μm or more and about 15 μm or less inthe width direction; a number of dielectric particles in each of thefirst dielectric ceramic layers in a thickness direction correspondingto the lamination direction is three or more and six or less; a numberof dielectric particles present in each of the additional dielectricceramic layers in a thickness direction corresponding to the widthdirection is 100 or more and 150 or less; and when the number ofdielectric particles in each of the first dielectric ceramic layers inthe thickness direction is defined as N_(T), and the number ofdielectric particles in each of the additional dielectric ceramic layersin the thickness direction is defined as N_(W), a ratio of N_(T) toN_(W) is about 1:23.08 or more and about 1:46.15 or less.
 2. Themultilayer ceramic capacitor according to claim 1, wherein an averageparticle size of the dielectric particles in each of the firstdielectric ceramic layers is larger than an average particle size of thedielectric particles in each of the additional dielectric ceramiclayers.
 3. The multilayer ceramic capacitor according to claim 1,wherein a maximum deviation amount in the width direction of edges ofthe internal electrode layers defining and functioning as the first sidesurface and the second side surface of the multilayer body is about 0.5μm or less.
 4. The multilayer ceramic capacitor according to claim 1,wherein the additional dielectric ceramic layers each include Mg, and acontent of Mg in the additional dielectric ceramic layer is greater thana content of Mg in each of the first dielectric ceramic layers.
 5. Themultilayer ceramic capacitor according to claim 1, wherein themultilayer ceramic capacitor has a dimension in the length direction ofabout 0.40 mm or more and about 0.60 mm or less in the length direction,a dimension in the width direction of about 0.20 mm or more and about0.30 mm or less, and a dimension in the lamination direction of about0.20 mm or more and about 0.50 mm or less.
 6. The multilayer ceramiccapacitor according to claim 1, wherein each of the external electrodesincludes a laminated film including a sintered metal layer and a platedlayer.
 7. The multilayer ceramic capacitor according to claim 6, whereinthe sintered metal layer includes at least one of Cu, Ni, Ag, Pd, Ag—Pdalloy, and Au.
 8. The multilayer ceramic capacitor according to claim 6,wherein the plated layer includes a Ni-plated layer and a Sn-platedlayer covering the Ni-plated layer.
 9. The multilayer ceramic capacitoraccording to claim 1, wherein each of the dielectric ceramic layersincludes barium titanate as a main component.
 10. The multilayer ceramiccapacitor according to claim 9, wherein each of the dielectric layersincludes at least one of Si, Mg, Mn, Sn, Cu, rare earth, Ni, or Al as anadditive.
 11. The multilayer ceramic capacitor according to claim 1,wherein each of the internal electrodes includes at least one of Ni, Cu,Ag, Pd, Ag—Pd alloy, or Au.